What will computer chips look like in 2045?

Intel's leadership walks through how advanced process nodes are brought to volume, from yield learning and the lessons of 10nm to the shift from planar transistors to gate-all-around, High-NA EUV, backside power, and CFET. The discussion widens to the chip-to-chip bottleneck that hybrid bonding targets, the supply limits on EUV tooling as AI compute demand grows, and the economics that make foundry scale decisive.